HX BOND+

HX Bond+ is Self Etch 8th Gen Bonding agent.

UNIVERSAL Bonding Agent (Self, Total, and Selective Etch), experience maximum bond strength and long-term bonding with HX.Bond+. Combining of 2 monomer MDP & MTA, and with a moisture-resistant Bis-GMA resin matrix, it delivers flexible, durable adhesion while minimizing patient sensitivity (mild etch, pH < 4).

Formulated with an efficient ethanol-water carrier and reinforced with (20 nm) nano-fillers, HX.Bond+ ensures high mechanical performance tested in accordance with ISO 29022:2013. The reliable, effortless choice for your daily direct restorations.

KEMENKES RI AKD 20602320532

  • Features
  • Indications
  • Instructions for Use
  • Download
  • Self Etch
  • Combination of MDP and MTA Monomer
  • Contains Silane and Nano Filler (20 nano)
  • More Translucent Color
  • PH<4
  • Shear Bond Strength >25 Mpa

As a Self Etch Bonding Agent (Adhesive) in Restoration applications.

  • Clean the layer to be applied with a brush.
  • Rinse the layer/tooth to be applied thoroughly with water, then dry with air.
  • Perform etching (37% Phosphoric Acid) for 15 seconds, rinse with water, then dry.
  • Apply HX. Bond+ Bonding with a brush, spread evenly, let stand for 10 seconds.
  • Apply a small amount of air to evaporate the acetone solvent.
  • Perform UV Light Cure process, then proceed with the Restoration process.

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