HX BOND+

HX.Bond+ is a Self Etch bonding agent, specially formulated to produce strong, durable, and efficient adhesion. It contains MDP and 4-Meta monomers, and BisGMA-based resin for more flexible adhesion and resistance to moisture. HX.Bond+ uses ethanol and water as solvents, and contains narrow distribution nano-filler particles (20 nm) and a silane coupling agent to produce high mechanical properties (ISO 29022:2013). With a pH <4 (mild etching).

KEMENKES RI AKD 20602320532

Features
Indications
Instructions for Use
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Self Etch
Combination of MOP and MTA Primer
Contains Silane and Nano Filler (20 nano)
More Translucent Color
PH<4
Shear Bond Strength >25 Mpa

As a Self Etch Bonding Agent (Adhesive) in Restoration applications.

Clean the layer to be applied with a brush.
Rinse the layer/tooth to be applied thoroughly with water, then dry with air.
Perform etching (37% Phosphoric Acid) for 15 seconds, rinse with water, then dry.
Apply HX. Bond+ Bonding with a brush, spread evenly, let stand for 10 seconds.
Apply a small amount of air to evaporate the acetone solvent.
Perform UV Light Cure process, then proceed with the Restoration process.

☁ Download HX Bond+ Brochure (PDF)

☁ Download HX Bond+ MSDS (PDF)